GENEVA, March 31 -- INTERDIGITAL PATENT HOLDINGS, INC. (200 Bellevue Parkway, Suite 300Wilmington, Delaware 19809) filed a patent application (PCT/US2025/046558) for "PREDICTIVE SENSING AREA MANAGEMEN... Read More
GENEVA, March 31 -- EXXONMOBIL TECHNOLOGY AND ENGINEERING COMPANY (22777 Springwoods Village ParkwaySpring, Texas 77389) filed a patent application (PCT/US2025/046537) for "PRODUCING GRAPHITIC PARTICL... Read More
GENEVA, March 31 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/046195) for "TECHNIQUES FOR... Read More
GENEVA, March 31 -- YIELD ENGINEERING SYSTEMS, INC. (3178 Laurelview CourtFremont, California 94538) filed a patent application (PCT/US2025/046601) for "HIGH TEMPERATURE ANNEALING OF SEMICONDUCTOR SUB... Read More
GENEVA, March 31 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/046207) for "COMMON-MODE (C... Read More
GENEVA, March 31 -- THE JOHNS HOPKINS UNIVERSITY (3400 N. Charles StreetBaltimore, MD 21218) filed a patent application (PCT/US2025/046520) for "AN IMAGING SYSTEM FOR NAVIGATING SURGERY FOR NON-CONTAC... Read More
GENEVA, March 31 -- OHIO STATE INNOVATION FOUNDATION (Energy Advancement and Innovation Center, 2nd floor2281 Kenny RoadColumbus, Ohio 43210) filed a patent application (PCT/US2025/046174) for "AN ALL... Read More
GENEVA, March 31 -- CORNING INCORPORATED (One Riverfront PlazaCorning, New York 14831) filed a patent application (PCT/US2025/046463) for "ARTICLE WITH SUBSTRATE AND MULTILAYER THIN-FILM COATING WITH ... Read More
GENEVA, March 31 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, CA 95054) filed a patent application (PCT/US2025/046189) for "SULFUR BASED RESIST HARDENING" on Sep 12, 2025. With publicati... Read More
GENEVA, March 31 -- WOLFSPEED, INC. (4600 Silicon DriveDurham, NC 27703) filed a patent application (PCT/US2025/046551) for "POWER SEMICONDUCTOR DEVICES WITH BOND PADS HAVING STRUCTURAL SUPPORT LAYERS... Read More